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PartManufacturerDescriptionDownloads
SG-BGA-7116Ironwood ElectronicsHigh Density GHz BGA Sockets; Max Pincount: 515; Top Pitch (mm): 0.4; IC Array X: 28; IC Array Y: 28; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: PoP; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.87; IC Size X (mm): 12; IC Size Y (mm): 12; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.13; IC Ball Height Max (mm): 0.23; IC Ball Diameter Max (mm): 0.31; Max Package Code: BGA515; Part Description: GHz BGA Socket (ZIF)-HD
5962-87671163ATexas InstrumentsReplaced by TIBPAL20R8-7M : High-Performance Impact-X<TM> PAL(R) Circuits 28-LCCC -55 to 125
5962-8767116KATexas InstrumentsReplaced by TIBPAL20R8-7M : High-Performance Impact-X<TM> PAL(R) Circuits 24-CFP -55 to 125
5962-8767116LATexas InstrumentsReplaced by TIBPAL20R8-7M : High-Performance Impact-X<TM> PAL(R) Circuits 24-CDIP -55 to 125
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